Product details
2015 new manufacturing Double sided Immersion Gold PCB
Product details
Specification
- Base Material: FR4
- Number of Layers: 2 Layer
- Board Thickness: 1.6 mm
- Copper Thickness: 1OZ
- Min. Hole Size: 3mil (0.075mm)
- Min. Line Spacing: 3mil (0.075mm)
- Min. Line Width: 3mil (0.075mm)
- Surface Finishing: ENIG, Immersion Gold
- Material supplier: SY
- Solder Mask Color: Blue
- Certificate: UL, ISO 9001, ISO 14001
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Seller information
| ABP ELECTRONICS LIMITED | |
| Name | jane cao
|
| Telephone: | 0086-0755-26054178 |
| Fax: | 0086-0755-26435488 |
| Mobile: | |
| Location: | shenzhen Guangdong |
| Address: | 6/F,4th Block, Zhuguang Chuangxin Science & Technology Park, Zhuguang Rd, Xili,Nanshan,Shenzhen, P.R.C |
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